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RE: Semiconductor Packaging
- To: <ukha_d@xxxxxxx>
- Subject: RE: Semiconductor Packaging
- From: "Keith Doxey" <ukha@xxxxxxx>
- Date: Wed, 6 Jun 2001 14:57:24 +0100
- Delivered-to: rich@xxxxxxx
- Delivered-to: mailing list ukha_d@xxxxxxx
- Mailing-list: list ukha_d@xxxxxxx; contact
ukha_d-owner@xxxxxxx
- Reply-to: ukha_d@xxxxxxx
Most have legs down each side unless they are PLCC or similar, then they
have legs all round.
SOIC have very small legs and are surface mount
You want DIL aka DIP Dual Inline 0.1" pin spacing ready for a
breadboard.
Anything else is a real bugger.....to see never mind prototype with....or
are my eyes just getting worse :-(
DIL are the ones you can make disappear by placing them on the bench with
their legs in the air then leaning on the bench with the palms of your
hands. Easy to locate them though.....look at the hand that hurts like hell
and pull the critter out of your flesh ;-))
Keith
> -----Original Message-----
> From: Mick Furlong [mailto:dorsai@xxxxxxx]
> Sent: 06 June 2001 14:40
> To: ukha_d@xxxxxxx
> Subject: [ukha_d] Semiconductor Packaging
>
>
> Just wondering which are the best packages for prototyping?
>
> SOIC PDIP flipchip etc...also does anyone have a link giving a
> description of
> all of these types of packaging ...basically I know what I want
> which are the
> lil black things that have lil legs down each side are these SOIC?
>
> Ta
> Mick
>
>
>
>
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