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RE: Semiconductor Packaging


  • To: <ukha_d@xxxxxxx>
  • Subject: RE: Semiconductor Packaging
  • From: "James Hoye" <james.hoye@xxxxxxx>
  • Date: Wed, 6 Jun 2001 15:31:25 +0100
  • Delivered-to: rich@xxxxxxx
  • Delivered-to: mailing list ukha_d@xxxxxxx
  • Mailing-list: list ukha_d@xxxxxxx; contact ukha_d-owner@xxxxxxx
  • Reply-to: ukha_d@xxxxxxx

> I asked this one and came up with (P)DIP (what a basic stamp look
like)
> but I could be oh so wrong!

http://www.xs4all.nl/~ganswijk/chipdir/package.htm#packaging
explains loads
of package types
http://www.logicaldevices.net/support/adapters/index.htm
has some pictures!

James




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