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RE: Semiconductor Packaging

To: <ukha_d@xxxxxxx>
Subject: RE: Semiconductor Packaging
From: "James Hoye" <james.hoye@xxxxxxx>
Date: Wed, 6 Jun 2001 15:31:25 +0100
Delivered-to: rich@xxxxxxx
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Reply-to: ukha_d@xxxxxxx

> I asked this one and came up with (P)DIP (what a basic stamp look
like)
> but I could be oh so wrong!

http://www.xs4all.nl/~ganswijk/chipdir/package.htm#packaging
explains loads
of package types
http://www.logicaldevices.net/support/adapters/index.htm
has some pictures!

James




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