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Re: Semiconductor Packaging
- To: ukha_d@xxxxxxx
- Subject: Re: Semiconductor Packaging
- From: andy.powell@xxxxxxx
- Date: Wed, 6 Jun 2001 15:48:17 +0200
- Delivered-to: rich@xxxxxxx
- Delivered-to: mailing list ukha_d@xxxxxxx
- Mailing-list: list ukha_d@xxxxxxx; contact
ukha_d-owner@xxxxxxx
- Reply-to: ukha_d@xxxxxxx
I asked this one and came up with (P)DIP (what a basic stamp look like)
but I could be oh so wrong!
Andy
"Mick Furlong" <dorsai@xxxxxxx>
06/06/2001 15:40
Please respond to ukha_d
To: <ukha_d@xxxxxxx>
cc:
Subject: [ukha_d] Semiconductor Packaging
Just wondering which are the best packages for prototyping?
SOIC PDIP flipchip etc...also does anyone have a link giving a description
of
all of these types of packaging ...basically I know what I want which are
the
lil black things that have lil legs down each side are these SOIC?
Ta
Mick
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